Protocol Compatibility:Supports diverse industrial protocols including Profinet, EtherCAT, and CANopen
Data Transfer Rate:Maximizes throughput with speeds up to 1 Mbps
Power Consumption:Operates on low power consumption, ensuring minimal energy use
Temperature Range:Works within an extended temperature range of -25°C to +70°C
Connectivity Options:Offers versatile connectivity through RJ45 and DB9 connectors
Dimensions:Compact design with dimensions of 120mm x 100mm x 30mm
Material:Manufactured from high-grade aluminum alloy for durability and heat dissipation
Communication Interfaces:Supports both wired and wireless communication options
The ABB CI865K01 3BSE040795R1 Communication Module is a cornerstone of advanced industrial automation, engineered to enhance system performance and reliability. Its compatibility with a wide array of industrial protocols ensures seamless integration with existing machinery, enabling optimized data flow between different components of your production line.
With its impressive data transfer rate, this module ensures that information is transmitted quickly and efficiently, reducing downtime and improving operational efficiency. The low power consumption design not only saves energy but also extends the operational lifespan of your automation system.
Adapted to operate within extreme environmental conditions, the CI865K01 is capable of functioning effectively in temperatures ranging from -25°C to +70°C, making it suitable for harsh industrial environments. Its robust construction and compact size offer a perfect blend of functionality and space optimization.
Equipped with multiple connectivity options, including RJ45 and DB9 connectors, the module offers flexibility in connecting to various devices. Whether you need wired or wireless communication, the ABB CI865K01 provides versatile solutions tailored to your specific requirements.
Constructed from high-quality aluminum alloy, the module is designed for exceptional durability and effective heat dissipation, ensuring long-term reliability and performance. This choice of material not only contributes to the module’s longevity but also enhances its overall efficiency in managing the heat generated by electronic components.
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