Product Type:Interface Module Backplane
Exhibitors:Honeywell
Model Number:8C-TAIDB1/51307133-175
Weight (kg):0.56
Size (mm):160 x 100 x 50
Operating Temperature (°C):-20 to +70
Storage Temperature (°C):-40 to +85
Operating Humidity (%):5 to 95 non-condensing
Input Voltage (V):24 VDC
Output Current (A):5 A
Connection Type:DB9 Connector
Communication Protocol:RS-485, Modbus
The Honeywell 8C-TAIDB1/51307133-175 Interface Module Backplane is designed with cutting-edge technology to ensure unparalleled performance in demanding industrial environments. This backplane facilitates efficient data exchange between control devices, enhancing system reliability and responsiveness.
Crafted from high-quality materials for durability and long service life, it withstands harsh industrial conditions without compromising on performance. Its modular design allows for easy integration with existing systems, streamlining installation and maintenance processes.
Featuring an open architecture compatible with leading industry protocols like Modbus TCP/IP, this module ensures seamless communication across diverse systems, promoting flexibility and scalability in automation solutions.
With a wide operating temperature range (-20°C to +60°C) and robust compliance with international safety standards (CE, UL, CSA), the Honeywell 8C-TAIDB1/51307133-175 Interface Module Backplane is suitable for deployment in a variety of global industrial settings.
Our commitment to innovation extends to providing comprehensive support, including technical documentation, application guides, and customer assistance, ensuring that you receive the most out of our products.
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